| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus having the favorable uniformity of a plasma treatment which can reduce abnormal discharge such as a discharge concentration. Ž<P>SOLUTION: A plasma treatment apparatus has: a treatment chamber 10 where a plasma treatment is carried out to a substrate 20; a ground electrode 12 arranged in the treatment chamber 10 and to which the substrate 20 is mounted; and a hollow electrode 18 having a hollow shape surrounding a gas supplying space 14c, and in which an electrode plate 16 opposed to the ground electrode 12 has a plurality of gas ejection holes 16a to 16g through which gases are ejected from the gas supplying space 14c, and in which an electrode body 14a exposed from the treatment chamber 10 to the outside is connected to a high-frequency power supply 24, and in which an electrode body 14a has a gas supplying hole 14d for supplying gas to the gas supplying space 14c. In the center A separating from a side wall 14b of the gas supplying space 14c, a mesh-like metal member 30 electrically connecting the electrode plate 16 and the electrode body 14a is housed in the gas supplying space 14c. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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