发明名称 METHOD FOR FORMING OXIDE LAYER ON ALUMINUM SURFACE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming an aluminum-oxide film on a surface of an aluminum film formed on a substrate, by immersing the surface of the aluminum film into nitric acid with the concentration of 70%. Ž<P>SOLUTION: The oxide-film-forming method includes immersing the aluminum surface into nitric acid with the concentration of 70% under a condition of room temperature lower than 40°C for ten minutes or longer to form the aluminum oxide film with a thickness of 4 nm or more. The aluminum oxide film has various superior electric characteristics as a high insulative dielectric layer or a passivated layer, and can be used for a high-performance functional element of an electron device. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010180458(A) 申请公布日期 2010.08.19
申请号 JP20090025813 申请日期 2009.02.06
申请人 KIT:KK;OSAKA UNIV 发明人 KOBAYASHI HIKARI
分类号 C23C22/06;C23C14/58;H01L21/316 主分类号 C23C22/06
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