发明名称 SEALING DEVICE OF SUBSTRATE SURFACE AND MANUFACTURING METHOD OF ORGANIC EL PANEL
摘要 <P>PROBLEM TO BE SOLVED: To enable to realize lamination in which improvement of tact time is achieved and deterioration of performance of a product is prevented by saving labor of operation. <P>SOLUTION: As for a film 13 from film rolls 24a to 24d (Fig.6 (not illustrated)) of a film unwinding mechanism part 14, its cover film 13a (Fig.4 (not illustrated)) is peeled off by a cover film winding mechanism part 15, and sent to an inter-substrate processing mechanism part 16. In the inter-substrate processing mechanism part 16, by a half-cut member 34 and a peel-off tape 36 (Fig.7 (not illustrated)), as expressed in Fig.9 (not illustrated), a sealing material film 5' (Fig.4 (not illustrated)) of the film 13 is peeled off by a prescribed length at a prescribed spacing, and the sheet-like sealing member 5 (Fig.3 (not illustrated)) is formed. The film 13 processed like this is sent to a lamination mechanism part 19, the sheet-like sealing member 5 is heated and crimped to the substrate 1 from a front room 10 and cooled by a substrate cooling mechanism part 30, and a base film 13b (Fig.4 (not illustrated)) of the film 13 is peeled off by a base film winding mechanism part 21. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010182530(A) 申请公布日期 2010.08.19
申请号 JP20090024948 申请日期 2009.02.05
申请人 HITACHI PLANT TECHNOLOGIES LTD;SHARP CORP 发明人 KUNIHIRO TATSUTO;TAKAHASHI KAZUO;OTA AYAFUMI
分类号 H05B33/04;G09F9/00;H01L51/50;H05B33/10 主分类号 H05B33/04
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