| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transfer chamber and a particle deposition preventing method which can prevent particles from being deposited on a treated substrate due to an electrostatic force by removing electricity from the treated substrate without causing damage to the treated substrate. <P>SOLUTION: In a substrate treatment system 1, a transfer chamber 4 provided between a substrate treatment unit 2 and an atmosphere system transfer unit 3 includes a chamber body 51 storing a wafer W serving as the treated substrate. The chamber body 51 can be switched between a reduced pressure environment and an atmospheric pressure environment by an air supply system 52 and an exhaust system 53. The air supply system 52 includes an ionizer 60 for generating ionized gas outside the chamber body 51. The ionized gas generated by the ionizer 60 is supplied to the chamber body 51 to remove electricity from the wafer W stored in the chamber body 51. <P>COPYRIGHT: (C)2010,JPO&INPIT |
