| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the yield in a manufacturing process by preventing an LSI from cracking and to improve the reliability. <P>SOLUTION: A substrate device for a medium includes a substrate 1 having an LSI mounting area 21, a land 3 formed on the LSI mounting area 21 of the substrate 1, and a projection portion 22 which is molded projecting integrally with the LSI mounting area 21 of the substrate 1 and receives an LSI 2 when a bump of the LSI is pressed against the land 3 when the LSI is mounted. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
