| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a micromirror device in which the deterioration of the flatness of a micromirror chip caused by the thermal contraction of a connecting member is reduced. Ž<P>SOLUTION: The micromirror device 100 includes: a micromirror chip 110; an electrode substrate 130; and a substrate holding member 170 which holds the micromirror chip 110 and the electrode substrate 130. The micromirror chip 110 has a movable mirror 112. The electrode substrate 130 is disposed facing the micromirror chip 110 with a distance from the micromirror chip 110. The substrate holding member 170 is composed of two plate-shaped members 172 which are mechanically and electrically connected to the side face of the micromirror chip 110 and the side face of the electrode substrate 130. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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