SOLDER BALL ATTACHING METHOD AND SOLDERING METHOD USING SAME

摘要

Provided are a method for attaching a solder ball to a substrate and a soldering method using the same. The solder ball attaching method according to the present invention: forms a liquid droplet on the substrate, and attaches the solder ball to the substrate by self-arranging the solder ball in the liquid droplet. In other words, the method: forms a solder ball land by allowing a portion of the substrate for solder ball attachment to be selectively hydrophilic; self-arranges the solder ball in the liquid droplet on the solder ball land; then forms a solder bump through the attachment of the solder ball to the substrate by evaporating the liquid droplet and allowing the solder ball to re-flow. The invention is able to reduce the costs required for facility investment by enabling the installation of the solder ball only through surface treatment and the use of the liquid droplet without a separate device for solder ball adsorption. In addition, the invention allows simple and rapid process through three steps consisting of surface treatment, application of the liquid droplet, and attachment of the solder ball so that prompt action is rapidly taken for the solder ball installation process.