| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor device wherein position displacement of a terminal can be easily known, and to provide a manufacturing method therefor. <P>SOLUTION: The power semiconductor device includes a semiconductor element, a resin housing, which covers the semiconductor element and has a resin housing recess part that is formed lower than the other part in the outer wall, and a terminal, which is electrically connected to the semiconductor element within the resin housing and extended from the resin housing recess part to the outside of the plastic housing. The position of the terminal within the resin housing recess part gives positional displacement information about the terminal. <P>COPYRIGHT: (C)2010,JPO&INPIT |
