| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a bridge failure incidence ratio in LSI manufactured in a microfabrication process. <P>SOLUTION: A bridge fault removal apparatus 10 includes a bridge fault extraction unit 14b configured to extract a bridge fault from layout information 16c of a semiconductor integrated circuit, a test pattern generator 14c configured to generate a test pattern 16f aiming at the bridge fault extracted by the bridge fault extraction unit 14b, a logical value information calculator 14e configured to calculate logical value information 16j of all the signals in the semiconductor integrated circuit by applying the test pattern 16f generated by the test pattern generator 14c to logical connection information 16b of the semiconductor integrated circuit, and a bridge fault remover 14f configured to select an exchange signal candidate for an undetected bridge fault signal corresponding to the test pattern 16f based on the logical value information 16j calculated by the logical value information calculator 14e. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
