| 摘要 |
The present invention provides an electronics device heat radiation material which is obtained by joining a metal impregnated carbon composite onto a copper or aluminum substrate in a state with reduced warp, and a production method for this heat radiation material. The present invention relates to a metal substrate-metal impregnated carbon composite structure including a metal substrate formed of a metal-made sheet, plate material, or block, and a metal impregnated carbon composite with a thickness of 0.1 to 2 millimeters joined to an upper surface of the metal substrate via a brazing material, and a production method for the metal substrate-metal impregnated carbon composite structure, including the steps of: interposing a brazing material between the metal substrate and the metal impregnated carbon composite, holding these at a temperature of 500 degrees centigrade or more under pressurization with 0.2 MPa or more, and cooling these. |
