发明名称 |
PROCESS FOR PLACING, SECURING AND INTERCONNECTING ELECTRONIC COMPONENTS |
摘要 |
A method for fabricating an electronic assembly which enables the assembly and interconnection of surface mount components and/or other electrical, electronic, electro-optical, electro-mechanical and user interface devices with external I/O contacts on a planar surface without the use of solder or otherwise exposing the components to temperatures substantially above ambient. |
申请公布号 |
EP2218311(A2) |
申请公布日期 |
2010.08.18 |
申请号 |
EP20080839148 |
申请日期 |
2008.10.14 |
申请人 |
PROMEX INDUSTRIES INCORPORATED |
发明人 |
BINKLEY, EDWARD, S.;CATTANEO, ROBERT, A.;NGHI, HIEP;LAURIE, GEORGE;OTTE, RICHARD, F. |
分类号 |
H05K1/18;H01L21/56;H01L21/683;H01L23/48;H01L25/16;H05K3/28 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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