| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR ITS PREPARATION, AND SEMICONDUCTOR DEVICES |
| 摘要 |
<p>The present invention provides a positive photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ratio and which can give a cured film superior in mechanical properties, adhesivity and water absorptivity. That is, the present invention lies in a positive photosensitive resin composition comprising 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitive diazoquinone compound (B) and a filler (C), characterized in that content F of the filler (C) represented by the following formula is 2 to 70% by weight: <DF>F = filler (C) / Äalkali-soluble resin + filler (C)Ü </DF> <IMAGE></p> |
| 申请公布号 |
EP1331517(B1) |
申请公布日期 |
2010.08.18 |
| 申请号 |
EP20010972721 |
申请日期 |
2001.10.09 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD.;INTEL CORPORATION |
发明人 |
HIRANO, TAKASHI;OKAAKI, SHUSAKU;MEAGLEY, ROBERT P.;GOODNER, MICHAEL D. |
| 分类号 |
G03F7/022;G03F7/023;C08G69/26;C08G69/40;C08G69/42;G03F7/004;G03F7/037;H01L21/027;H01L21/312 |
主分类号 |
G03F7/022 |
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