发明名称 Data centre cooling arrangements
摘要 A data centre building (100) includes at least one rack room (in for example module 140) having a floor and a plurality of rack storage areas on the floor, each rack storage area being arranged to accommodate a plurality of racks (143) in which a plurality of rack-mountable electronic components may be housed, one or more controllable air circulation systems (in for example module 122), one or more cold aisles (144) in the rack room, each cold aisle being adjacent to a rack storage area, and one or more hot aisles (145) in the rack room, each hot aisle being adjacent to a rack storage area. There may be a large air duct, in the form of a personnel corridor (123), for transporting, under the control of the one or more air circulation systems, cooling air, above the floor, to the one or more cold aisles. The air supply corridor/duct (123) may have a height greater than 1.5m above the floor and a cross-sectional area of at least 2m2and a maximum dimension in the plane of the cross-section of less than 3m. A duct may be provided which extends across the whole of a rack room. The data centre building may have a controlled air intake via a door and an airlock room. A rack insulation arrangement is also described in which insulation is provided within the rack between the hot and cold sides of the rack to reduce thermal conduction.
申请公布号 GB2467808(A) 申请公布日期 2010.08.18
申请号 GB20090009584 申请日期 2009.06.03
申请人 MODULECO LIMITED;MINJATA BVBA;BRIPCO BVBA 发明人 PAUL ROGERS
分类号 H05K7/20;E04H5/02 主分类号 H05K7/20
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