发明名称 |
Chemical mechanical polishing slurries, their applications and method of use thereof |
摘要 |
This invention disclosed a chemical mechanical polishing slurry, which includes at least one abrasive particle, an oxidant and a carrier. The oxidant is combined with a big metallorganic compound; and the applications and corresponding handling method are also disclosed. This invention slurry can realize high removal rate, no corrosion, low defectivity and high plan.
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申请公布号 |
US7776231(B2) |
申请公布日期 |
2010.08.17 |
申请号 |
US20060918956 |
申请日期 |
2006.04.19 |
申请人 |
ANJI MICROELECTRONICS (SHANGHAI) CO., LTD. |
发明人 |
YU CHRIS CHANG;YANG ANDY CHUNXIAO;SHIAO DANNY ZHENGLONG |
分类号 |
C09K13/00 |
主分类号 |
C09K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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