发明名称 |
Heatsink apparatus for applying a specified compressive force to an integrated circuit device |
摘要 |
An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.
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申请公布号 |
US7777329(B2) |
申请公布日期 |
2010.08.17 |
申请号 |
US20060460334 |
申请日期 |
2006.07.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COLBERT JOHN L.;CORBIN, JR. JOHN S.;EAGLE JASON R.;HAMILTON ROGER DUANE;MIKHAIL AMANDA E.;SINHA ARVIND K.;SOBOTTA TERRY L. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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