发明名称 |
Seal ring structure for integrated circuit chips |
摘要 |
A seal ring structure is disclosed for protecting a core circuit region of an integrated circuit chip. The seal ring structure includes a metallization layer, having a bridge sublevel and a plug sublevel. An upper-level bridge is formed on the bridge sublevel at a predetermined location between a peripheral edge of the integrated circuit chip and the core circuit region. A lower-level bridge is formed on the plug sublevel in substantial alignment with the upper-level bridge, wherein the lower-level bridge has a width substantially the same as that of the upper-level bridge.
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申请公布号 |
US7777338(B2) |
申请公布日期 |
2010.08.17 |
申请号 |
US20040940504 |
申请日期 |
2004.09.13 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
YAO CHIH-HSIANG;HUANG TAI-CHUN;CHI KUAN-SHOU;JENG CHIH-CHERNG;LIANG MING-SHUOH;WAN WEN-KAI;HSIA CHIN-CHIU |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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