The joint compound of the present invention utilizes hollow resin microspheres with a mean particle size less than 75 microns and exhibiting no more than 1.5 % increase in density under high shear stress testing.
申请公布号
CA2396125(C)
申请公布日期
2010.08.17
申请号
CA20012396125
申请日期
2001.11.16
申请人
UNITED STATES GYPSUM COMPANY
发明人
IMMORDINO, SALVATORE C., JR.;MILLER, CHARLES J.;CIMAGLIO, SCOTT A.;PICKLES, DAVID MARTIN
