TRANSPARENT RESIN FOR ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE INCLUDING THE SAME

摘要

PURPOSE: A transparent resin composition for an encapsulation material, and an electronic device including thereof are provided to improve the refractivity and the transmittivity of the composition, and to secure the heat resistance. CONSTITUTION: A transparent resin composition for an encapsulation material contains polymetallosiloxane obtained by copolymerizing a metal compound marked with chemical formulas 1A~1D, and a silicon compound marked with chemical formula 2. 1~70wt% of polymetallosiloxane is contained in the transparent resin composition. The composition also contains 0.1~100 ppm of hydrosilylation catalyst.