发明名称 Printed wiring board and production method thereof
摘要 The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conductor circuit free from undercuts which is produced by carrying out additional plating to fill undercuts.
申请公布号 US7776199(B2) 申请公布日期 2010.08.17
申请号 US20040567779 申请日期 2004.08.11
申请人 FUJIKURA LTD. 发明人 FUJINAMI HIDEYUKI;HIGUCHI REIJI;KOBAYASHI KAZUHARU
分类号 C25D5/02;H05K3/06;H05K3/10 主分类号 C25D5/02
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