发明名称 |
Printed wiring board and production method thereof |
摘要 |
The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conductor circuit free from undercuts which is produced by carrying out additional plating to fill undercuts.
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申请公布号 |
US7776199(B2) |
申请公布日期 |
2010.08.17 |
申请号 |
US20040567779 |
申请日期 |
2004.08.11 |
申请人 |
FUJIKURA LTD. |
发明人 |
FUJINAMI HIDEYUKI;HIGUCHI REIJI;KOBAYASHI KAZUHARU |
分类号 |
C25D5/02;H05K3/06;H05K3/10 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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