| 摘要 |
PURPOSE: A sawing machine using a wire is provided to improve the quality of silicon wafers by preventing silicon ingot from being thermally expanded due to fractional heat generated from a silicon ingot cutting process. CONSTITUTION: A supplying bobbin(10) is pivotally installed. A collecting bobbin(20) is pivotally installed to be spaced apart from the supplying bobbin. One end of a wire is wound around the supplying bobbin, the other end of the wire is wound around the collecting bobbin. The wire is transferred from the supplying bobbin to the collecting bobbin by rotating the supplying bobbin and the collecting bobbin. A plate(50) is movably installed with respect to the wire, and an object is contacted with the wire to be cut. A cooling unit cools the object.
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