发明名称 METHOD OF MAKING SPUTTERING TARGET
摘要 A METHOD OF MAKING A LARGE MO BILLET OR BAR FOR A SPUTTERING TARGET WHEREIN TWO OR MORE BODIES COMPRISING MO ARE PLACED ADJACENT ONE ANOTHER (E.G. STACKED ONE ON THE OTHER) WITH MO POWDER METAL PRESENT AT GAPS OR JOINTS BETWEEN THE ADJACENT BODIES. THE ADJACENT BODIES ARE HOT ISOSTATICALLY PRESSED TO FORM A DIFFUSION BOND AT EACH OF THE METAL-TO-M POWER LAYER -TO-METAL JOINT BETWEEN ADJACENT BODIES TO FORM A BILLET OR BAR THAT CAN BE MACHINED OR OTHERWISE FORMED TO PROVIDE A LARGE SPUTTERING TARGET. THE NUMBER AND DIMENSIONS OF THE MO BODIES PLACED ADJACENT ONE ANOTHER ARE SELECTED TO YIELD A DESIRED LARGE SIZE THE BILLET OR BAR SUITABLE FOR THE SPUTTERING TARGET. THE BILLET OR BAR FOR THE SPUTTERING TARGET EXHIBITS A MICROSTRUCTURE COMPRISING EQUIAXED GRAINS OF LESS THAN 30 MICRONS GRAIN SIZE AND EXHIBITS A LOW OXYGEN CONTENT OF LESS LHAN ABOUT 100 PPM BV NVEIGHT. RL 213 (R/04
申请公布号 MY141993(A) 申请公布日期 2010.08.16
申请号 MYPI20064028 申请日期 2006.08.25
申请人 HOWMET CORPORATION 发明人 GREG A. BUTZER;ROBERT H. HUIZENGA;STEVEN D. MUSSMAN
分类号 B23K20/10 主分类号 B23K20/10
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