发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving productivity by easily positioning terminal blocks to two tabular conductors without using an exclusive jig. SOLUTION: Curved swelling parts 38 are formed at connection strips 21a, 22a of the conductors 21, 22 which are joined to upper surfaces of transistors UH, UL, and feedback diodes DUH, DUL, respectively. The terminal blocks 69 are brought into contact with the curved swelling parts 38 and positioned, and in this state, the terminal blocks 69 are fixed to upper surfaces of the connection strips 21a, 22a. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177574(A) 申请公布日期 2010.08.12
申请号 JP20090020658 申请日期 2009.01.30
申请人 HONDA MOTOR CO LTD 发明人 SEKI MASANARI;HASEGAWA KUNIO
分类号 H01L25/07;H01L23/36;H01L25/18 主分类号 H01L25/07
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