摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sticking device suitable for obtaining a fixation effect of sheet-like resin and further achieving miniaturization and height reduction when a shield material is stuck to an electronic circuit module. Ž<P>SOLUTION: The sticking device is provided with: a stage 11 for mounting a stuck member; and a head 8 on which a plurality of pins 9 each elastically supported by independent elastic member are implanted, which is arranged opposite to the stage, and movable in the direction for approaching to and separating from the stage, pressurizes an insulating resin sheet 2 which is a shield member 3 to the stuck member by the head 8, fills the insulating resin along the shapes of electronic components 6, 7, etc., to be hardened between the electronic components. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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