| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a production process of electronic component package having fully assured reliability. Ž<P>SOLUTION: The process of making an electronic component package includes preparing a silicon substrate, forming an insulating film on the first plane of the silicon substrate, forming an insulating film having a bowl shape with a film thickness gradually reducing from an outer periphery part of the silicon substrate toward its central part on the second plane facing the first plane of the silicon substrate, applying resist on the bowl-shaped insulating film and carrying out patterning of the resist aperture corresponding to a cavity-forming region to form a resist mask, and forming a cavity by etching using the resist mask as a mask pattern. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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