| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin capable of obtaining a cured product having heat-resistance and high thermal conductivity, and an epoxy resin composition. Ž<P>SOLUTION: The cured product obtained by curing the epoxy resin composition containing the epoxy resin represented by formula (1) (wherein R each independently represents a hydrogen atom or a methyl group, R<SB>1</SB>and R<SB>2</SB>each independently represents a hydrogen atom, a 1-8C hydrocarbon group, a trifluoromethyl group, an aryl group or a methoxy group) and a curing agent is excellent in heat-resistance and has high thermal conductivity. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
