发明名称 Exposed Pad Backside Pressure Sensor Package
摘要 A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.
申请公布号 US2010199777(A1) 申请公布日期 2010.08.12
申请号 US20090368402 申请日期 2009.02.10
申请人 发明人 HOOPER STEPHEN R.;MACDONALD JAMES D.;MCDONALD WILLIAM G.
分类号 G01L9/06;B65B11/00 主分类号 G01L9/06
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