| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device capable of treating a substrate under a fixed condition. SOLUTION: The substrate treatment device includes a plurality of guards 14 to 17, elevating mechanisms 40 to 43 for individually elevating the respective guards 14 to 17, and a control part 10. The guards 14 to 17 include cylindrical portions 18e, 19a, 20a, 21a surrounding the whole circumference of a spin chuck 2 and annular extensions 18b, 19b, 20b, and 21b extending inward from upper end circumferences of the cylindrical portions 18e, 19a, 20a, and 21a. Each of extensions 18b, 19b, 20b, and 21b has the same inner diameter D1 as the other extension and is disposed so as to vertically overlap the other extension. The control part 10 controls the elevating mechanisms 40 to 43 so as to equalize heights of inner peripheral parts 18c, 19c, 20c, and 21c from a substrate holding position P1 of the spin chuck 2 whichever of guards 14 to 17 is caused to face a circumferential end surface of a substrate W. COPYRIGHT: (C)2010,JPO&INPIT |
