| 摘要 |
In a manufacturing method for divisionally exposing a wafer, a focus correction processing is performed after a shot is moved to a position where the focus correction processing for all foci is enabled when the shot is at a wafer outer periphery, and a portion overlapped with an adjacent exposure area is shielded from light by a reticle blind to expose only an opening area unshielded by the reticle blind.
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