| 摘要 |
A prepreg, a prepreg laminate including the prepreg, a metal film laminate including the prepreg, and a printed wiring board including the prepreg. The prepreg includes a woven or non-woven fabric substrate; and an aromatic liquid-crystalline polyester amide copolymer, wherein the woven or non-woven fabric substrate is impregnated with the aromatic liquid-crystalline polyester amide copolymer. Therefore, the prepreg is not deformed or does not cause blisters. In addition, the prepreg has low dielectric properties in a high frequency range. Also, a metal film of the metal film laminate or the printed wiring board does not corrode.
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