| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical module that is improved in wire bonding durability and also improved in yield and reliability, and to provide the optical module manufactured by the method. <P>SOLUTION: The method of manufacturing the optical module 30 includes a step (Fig.4(b)) of forming a bump 32a on a chip of a driver IC 32, a step (Fig.4(d)) of sticking a mask tape 90 on the entire surface of a high-frequency signal line 36 to mask it, a step (Fig.4(e)) of supplying an NCP resin 93 to a mounting region of the driver IC, a step (Fig.4(f)) of curing the NCP resin 93 while heating and bonding a plurality of electrodes etc., on a module substrate 33 and the bump 32a using a bonder 95, a step (Fig.4(h)) of carrying out post-curing, a step (Fig.4(g)) of peeling the mask tape 90, and a step of connecting a plurality of high-frequency signal lines 36 and a VCSEL array 31 by a wire 37. <P>COPYRIGHT: (C)2010,JPO&INPIT |
