SILVER-PLATED COPPER FINE POWDER, CONDUCTIVE PASTE PRODUCED BY USING SILVER-PLATED COPPER FINE POWDER AND METHOD OF PRODUCING SILVER-PLATED COPPER FINE POWDER

摘要

PROBLEM TO BE SOLVED: To provide silver-plated copper fine powder which is excellent in conductivity and reproducibility upon silver-plating reaction by solving problems in conventional silver-plated copper fine powder such as the occurrence of variation of color tone after silver-plating reaction in accordance with an oxidized state of copper fine powder before silver plating and the occurrence of mechanical deformation traces on the surface of flake-shaped silver plated copper fine powder, and to provide a method of producing the silver-plated copper fine powder. SOLUTION: The method of producing the silver-plated copper fine powder comprises processes of: thermally treating copper fine powder processed into flake shape to oxidize the surface of the copper fine powder; subsequently removing and rinsing organic material on the surface of the copper fine powder in an alkaline solution; thereafter, pickling and rinsing oxides on the surface of the copper fine powder in an acidic solution; thereafter, adding a reductant into the acidic solution in which the copper fine powder is dispersed and adjusting pH of the solution to prepare a copper fine powder slurry; and continuously adding a silver ion solution to the copper fine powder slurry to form a silver layer on the surface of the copper fine powder according to electroless displacement plating and reduction type electroless plating. COPYRIGHT: (C)2010,JPO&INPIT