发明名称 LED PACKAGE AND BACK LIGHT UNIT USING THE SAME
摘要 Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
申请公布号 US2010202131(A1) 申请公布日期 2010.08.12
申请号 US20080680097 申请日期 2008.09.19
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 KIM TAE KWANG;LEE CHUNG HOON;KIM DO HYUNG;RYU SEUNG RYEOL;JEONG CHAN SUNG;HWANG WOONG JOON
分类号 G02F1/13357;H01L33/58 主分类号 G02F1/13357
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