发明名称 |
LED PACKAGE AND BACK LIGHT UNIT USING THE SAME |
摘要 |
Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
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申请公布号 |
US2010202131(A1) |
申请公布日期 |
2010.08.12 |
申请号 |
US20080680097 |
申请日期 |
2008.09.19 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
KIM TAE KWANG;LEE CHUNG HOON;KIM DO HYUNG;RYU SEUNG RYEOL;JEONG CHAN SUNG;HWANG WOONG JOON |
分类号 |
G02F1/13357;H01L33/58 |
主分类号 |
G02F1/13357 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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