| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of improving connecting reliability of an external connection electrode. <P>SOLUTION: A wiring layer 60, including an external connection region 61, is provided on a main surface, opposite to a semiconductor-element mounting side in an insulting resin layer 40. The wiring layer 60 is covered by a protection layer 62. In the protection layer 62, an opening is formed so as to expose the external connection region 61. The external connection region 61 is formed recessed, as going toward the insulating resin layer 40. A solder ball 70 for mounting elements on a substrate is filled in the opening and at the same time, is filled in the recess of the external connection region 61 to be connected to an interposing layer 64. <P>COPYRIGHT: (C)2010,JPO&INPIT |
