| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a lowering in reliability of a semiconductor device and to reduce a manufacturing cost of the semiconductor device. <P>SOLUTION: A planar shape of a sealing body 2 comprises a quadrangle having a pair of first sides 2a and a pair of second sides 2b crossing to the first sides 2a, a die pad 3, a controller chip (a first semiconductor chip) 6 mounted on the die pad 3, a sensor chip (a second semiconductor chip) 1, and a plurality of leads 5 arranged along the first sides 2a of the sealing body 2. The controller chip 6 and the leads 5 are electrically connected through wires (first wires) 8a, and a sensor chip 1 and the controller chip 6 are electrically connected through wires (second wires) 8b. The die pad 3 is supported by a plurality of hanging leads 4 integrally formed with the die pad 3 and extending from the die pad 3 to the first sides 2a of the sealing body 2, and the hanging leads 4 respectively have offset parts 4a. <P>COPYRIGHT: (C)2010,JPO&INPIT |
