发明名称 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, TOUCH PANEL, AND DISPLAY DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide: a circuit board having a hardly-peelable printed layer and a method of manufacturing the same; a touch panel having a hardly-peelable printed layer; and a display device including the same. <P>SOLUTION: After a base layer 11 is formed on the whole of a surface of a base material 10 by sputtering, a conductive layer 12D is formed on the whole of the surface of the base layer 11 by sputtering (Fig.6(A)). Next, the conductive layer 12D is patterned using a photolithography method to form a first wiring layer 12 (Fig.6(B)). Next, a printed layer 13D is formed to cover the first wiring layer 12 using a printing method (Fig.6(C)). <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010177345(A) 申请公布日期 2010.08.12
申请号 JP20090016703 申请日期 2009.01.28
申请人 SONY CORP 发明人 TAZAWA HIROSHI
分类号 H05K3/38;G06F3/041 主分类号 H05K3/38
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