WAFER COATING METHOD AND APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wafer coating method and apparatus for achieving the effective utilization of a coating liquid and the uniformity of a coating liquid film.

SOLUTION: The wafer coating method includes the steps of: forming a liquid pool of demineralized water DIW by rotating a semiconductor wafer W at a first rotational frequency of low speed and supplying the demineralized water DIW to a center section of the semiconductor wafer W; and then mixing water-soluble coating liquid TARC with the mineralized water DIW by supplying the water-soluble coating liquid TARC to the center section of the semiconductor wafer W while the semiconductor wafer W is rotated at the first rotational frequency. Then, the coating liquid film is formed by rotating the semiconductor wafer W at a second rotational frequency higher than the first rotational frequency. A discharge quantity of the coating liquid TARC is set up by controlling a time ratio between the step of mixing the coating liquid with the demineralized water and the step of forming the coating liquid film to be within a range of 1:3 to 3:1.

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