| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system for treating a substrate. SOLUTION: The system for treating a substrate includes a coating unit, a pre/post-exposure treatment unit, and a developing unit. Each of the units includes a load port and an index module. The pre/post-exposure treatment unit includes first and second modules that are arranged in different layers. The first module performs a step for coating a protective layer on the wafer before an exposure step. The second module performs a step for cleaning the wafer and a post-exposure bake step after the exposure step. COPYRIGHT: (C)2010,JPO&INPIT |
