| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the periphery of an island is half-etched and an insulating resin attached to the part is sometimes peeled off in a thin type QFN (Quad Flat Non-leaded Package) package. SOLUTION: For the semiconductor device 51, while a semiconductor chip 58 is fixed on an island 55, it is disposed such that the side of the island 55 and the side of the semiconductor chip 58 match in the planar view. Also, it is fixed so as to dispose the corner part of the semiconductor chip 58, especially a contact, on a suspension lead 56 in the planar view. COPYRIGHT: (C)2010,JPO&INPIT
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