| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe card capable of keeping highly needle location accuracy of probe pins to the external terminal of a semiconductor wafer or the connection terminal of a substrate, and a method for manufacturing the same. Ž<P>SOLUTION: The probe card 1 includes: a plurality of probe pins 50 the one end side of which is a wafer-side plunger 51 and the other end side of which is a substrate-side plunger 52; a probe guide supporting a plurality of the probe pins 50 such that, while arranging a plurality of the probe pins 50 corresponding to arrangement of the external terminal of a semiconductor wafer, at least the wafer-side plunger 51 of the probe pins 50 is exposed, and a printed-circuit board 10 having a connection terminal 14 with which the substrate side plunger 52 of the probe pins 50 supported by the probe guide get into touch, while the probe guide is organized by stacking a substrate-side probe guide 30 at which the substrate-side plunger 52 of the probe pins 50 is located and a wafer-side probe guide 40 at which the wafer-side plunger 51 of the probe pins 50. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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