| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold structure for hot runner free from the concern about resin leakage. Ž<P>SOLUTION: In a fixed mold 1, a cavity block 5 is fixed to a fixed mounting plate 3 via a spacer 4, a manifold 6 is arranged inside the cavity block and the fixed mounting plate, and a packing 7 is arranged in the outlet side of a material passage 6a in the manifold. In a movable mold, a core block is fixed to a movable mounting plate. The mold structure comprises the fixed mold and the movable mold, wherein a molten resin material is introduced from a nozzle 16 into the material passage in the manifold and is charged from a hot nozzle 10 in the cavity block to a product cavity 11 formed between the core block and the cavity block. The manifold is arranged in a space 13 secured between the fixed mounting plate and the cavity block to absorb thermal expansion upon a temperature rise of the manifold, and the packing in the manifold side is elastically energized in the opening direction of the hot nozzle by interposing a regulation spring 15 between the manifold and the fixed mounting plate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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