| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package structure and a method of packaging for an interferometric modulator. Ž<P>SOLUTION: A transparent substrate 810 having an interferometric modulator 830 formed thereon is provided. A backplane 820 is joined to the transparent substrate 810 with a seal 840 where the interferometric modulator is exposed to the surrounding environment through an opening 850 in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer film is introduced into the package structure 800. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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