| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is a material of a resist film capable of obtaining good pattern configuration, less liable to elute into an immersion liquid for liquid immersion lithography, such as water, having a large receding contact angle to the immersion liquid, and less liable to cause development defects. <P>SOLUTION: The radiation-sensitive resin composition contains: a first polymer (A) having predetermined repeating units; a second polymer (B) which has an acid-dissociable functional group dissociating under the action of an acid and becomes alkali-soluble upon the dissociation of the acid-dissociable functional group; and a radiation-sensitive acid generator (C). <P>COPYRIGHT: (C)2010,JPO&INPIT |
