| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power converter capable of attaining miniaturization thereof while maintaining cooling performance by improving the rigidity of a metallic base. <P>SOLUTION: The metallic base 304 attached to a power module 300 has semiconductor devices 328, 330, 156, 166 mounted on one surface thereof and has the other surface fixed to cover an opening formed in a cooling water flow path 19 of a cooling jacket 19A. The metallic base plate 304 has thick portions 304a, 304b which are a mounting area mounted with the semiconductor devices and a fixed area for pressing and fixing an O-ring 800 on the cooling jacket 19A. Besides, the thickness of the mounting area is defined according to the radiation quantity for radiating the heat generated from the semiconductor device into refrigerant, and the rigidity of the thickness portions 304a, 304b is defined to be higher than that of the mounting area. Thus, deformation of a seal portion of the metallic base 304 due to a cooling water pressure can be restrained, sealing performance by the O-ring 800 can be ensured while maintaining radiation performance in the same way as a conventional one, and the size of the apparatus can be reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT |
