| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film removing apparatus more surely removing a film on a transparent substrate by a laser beam, and to provide a method of manufacturing a semiconductor device by which the film is more surely removed. <P>SOLUTION: The film removing apparatus removes a film 30 that is formed on a transparent substrate 2 having a thickness direction. A fixing part 61 is used to fix the transparent substrate 2, while a support part 65 is relatively displaceable in a direction crossing the thickness direction relative to the fixing part 61. A first laser head 64a and a second laser head 64b are supported on the support part 65 and provided with a first focal position Fa and a second focal position Fb respectively. The first focal position Fa and the second focal position Fb in the thickness direction are different from each other. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
