发明名称 WIRING BOARD, AND PROBE CARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wiring board of which the yield can be improved, and to provide a probe card using the same. SOLUTION: The wiring board 1 includes: a first insulative substrate 2 having a principal surface 2a; a first conductive member 5 provided on the principal surface 2a of the first insulative substrate; a second insulative substrate 3 having an opposite surface 3b facing the principal surface 2a of the first insulative substrate; a second conductive member 7 provided on the opposite surface 3b of the second insulative substrate 3; a resin member 4 located between the first insulative substrate 2 and the second insulative substrate 3; and a connection member 10 buried in the resin member 4 and electrically connecting the first conductive member 5 and the second conductive member 7. A projecting portion 5a which projects toward the opposite surface 3b and surrounds the periphery of the connection member 10 is formed on an upper surface of the first conductive member 5. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177429(A) 申请公布日期 2010.08.12
申请号 JP20090018118 申请日期 2009.01.29
申请人 KYOCERA CORP 发明人 ITO SEIICHIRO;WATANABE GEN
分类号 H05K3/46;G01R1/073;H01L21/66;H05K1/09 主分类号 H05K3/46
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