| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat resistance of a silicone-modified epoxy resin composition by compounding a compound having an adamantane skeleton, and to obtain a cured product having an extremely high toughness value. SOLUTION: The liquid epoxy resin composition for a semiconductor element contains (A) an adamantane derivative, (B) an aromatic amine-based curing agent, (C) a silicone-modified epoxy resin and (D) an inorganic filler. The semiconductor device is sealed with the cured product of the composition. The composition provides the cured product having strong toughness, excellent adhesion to the semiconductor element and a substrate, and excellent thermal shock resistance. COPYRIGHT: (C)2010,JPO&INPIT |
