发明名称 |
PACKAGE OF INFRARED SENSOR ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a package of an infrared sensor element which can prevent a joint of a lid and an infrared transmitting member from being damaged by a difference in a linear expansion coefficient between the lid and the infrared transmitting member. SOLUTION: The package 1 of the infrared sensor element A includes a package body 2 which is formed in a shape of a rectangular box opened at one side and has the infrared sensor element A provided on the inner bottom 2a, the lid 3 which has an opening for taking infrared rays into the package 1 from the outside of the package 1 and is joined to the package body 2 in a form of covering the one side of the package body 2, and the infrared transmitting member 4 which is provided in a form of covering the opening 3b of the lid 3. The lid 3 is provided with a first thin-walled portion (stress relaxing structure) 3d which is a flexible portion for relaxing thermal stress generated in the joint 5 of the lid 3 and the infrared transmitting member 4 by a difference between the linear expansion coefficient of the material forming the lid 3 and that of the material forming the infrared transmitting member 4. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010175341(A) |
申请公布日期 |
2010.08.12 |
申请号 |
JP20090017103 |
申请日期 |
2009.01.28 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
SANAGAWA YOSHIHARU;UEDA MICHIHIKO;HAYASHI SHINTARO |
分类号 |
G01J1/02;H01L23/02;H01L27/14;H01L37/00 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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