发明名称 MEMORY MODULE CUTTING OFF DM PAD LEAKAGE CURRENT
摘要 A memory module includes: an ODT circuit on a memory device and including pull-up and pull-down resistors connected between pull-up and pull-down transistors. A data masking (DM) pad is provided in a tap region of the module board. A current leakage monitoring unit is also provided and receives a ground state signal from the DM pad and a bit configuration signal from the memory device and disables the pull-up transistors to cut off a current path between the pull-up resistors of the ODT circuit and the DM pad during a ODT enable mode.
申请公布号 US2010202180(A1) 申请公布日期 2010.08.12
申请号 US20100693010 申请日期 2010.01.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM SEOK-IL;HAN YOU-KEUN;SEO SEUNG-JIN
分类号 G11C5/02;G11C7/00;G11C7/06 主分类号 G11C5/02
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