SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES

摘要

The invention relates to a sensor module comprising a carrier (1), at least one sensor chip (3) and at least one evaluation chip (4) that is electrically coupled to the sensor chip (3). The carrier (1) has a recess (2) wherein the sensor chip (3) is at least partially located. The evaluation chip (4) is arranged on the carrier (1) and covers the recess (2) at least partially.