SEMICONDUCTOR DEVICE COOLING STRUCTURE AND POWER CONVERTER PROVIDED WITH THE COOLING STRUCTURE

摘要

Provided is a cooling structure which can reduce the thermal resistance between a cooling body and a semiconductor and has a reduced size. A power converter has a plurality of semiconductor devices each of which is provided with: a semiconductor device which generates heat; and a cooling means composed of a first cooling body, which has the heat generating semiconductor device directly mounted thereon with a bonding means therebetween, and a second cooling body, which has a thermal capacity larger than that of the first cooling body.  The semiconductor devices are electrically insulated from each other by being housed in an insulating case.